Special form of the CVD method. By PECVD processes the component which is given off are direct given off from the gase phase (plasma) itself. In that case the plasma causes a breaking of the plasma molecules and produces radicals which causes the chemical deposition reaction on the substrate.   The deposition will usually provide the substratum to be coated with an additional potential at this way.   At sources of IPT this isn’t necessary! (self-biasing-effect!)