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>> Applications >> Sputter Effect
Sputter Effect
Physical process by which atoms or molecules are sprayed out from solid materials only by ion bombardment with high energetic ions. This ions change from solid phase (into the subtract material) to the gas phase.
 
Used methods are:
 
IE = Ion Etching
Inert ions will be accelerated to the substrate
Substrate in contact with the plasma
 
IBE = Ion Beam Etching
Inert ions, which are accelerated by an ion beam source, are used
Substrate not in contact with the plasma
 
RIE = Reaktive Ion Etching
Etching with reactive ions
Substrate in contact with the plasma
 
RIBE = Reaktive Ion Beam Etching
Reactive ions, which are accelerated by an ion beam source, are used
Substrate not in contact with the plasma
 
PE = Plasma Etching
Chemical Etching with free radicals and less support of free ions.
 
BE = Barrel Etching
Chemical Etching only by the use of free radicals